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Fangqing Mu
Fangqing Mu
Materials science
Electronic engineering
Composite material
Surface micromachining
Microchannel
5
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17
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Micromachined cavity-based bandpass filter and suspended planar slow-wave structure for vacuum-microelectronic millimeter-wave/THz microsystem embedded in LTCC packaging substrates
2015
ECTC | Electronic Components and Technology Conference
Min Miao
Runiu Fang
Xiaoqing Zhang
Biao Ning
Fangqing Mu
Zhensong Li
Wei Xiang
Yufeng Jin
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Investigation of micromachined LTCC functional modules for high-density 3D SIP based on LTCC packaging platform
2013
ECTC | Electronic Components and Technology Conference
Min Miao
Yufeng Jin
Runiu Fang
Fangqing Mu
Shichao Guo
Xiaoqing Zhang
Yang Zhang
Duwei Hu
Zhensong Li
Wei Xiang
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Investigation of a unified LTCC-based micromachining and packaging platform for high density/multifunctional microsystem integration
2012
ECTC | Electronic Components and Technology Conference
Min Miao
Yufeng Jin
Hua Gan
Jing Zhang
Yunsong Qiu
Yang Zhang
Yang-Fei Zhang
Rui Cao
Zhensong Li
Zhengyi Wang
Fangqing Mu
Chengchen Gao
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Process research of LTCC substrate with 3D micro-channel embedded
2009
ICEPT | International Conference on Electronic Packaging Technology
Fangqing Mu
Zhengyi Wang
Yang-Fei Zhang
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Nanoscale mechanical properties and microstructure of 3D LTCC substrate
2009
ICEPT | International Conference on Electronic Packaging Technology
Yang-Fei Zhang
Jia-Qi Chen
Shu-Lin Bai
Min Miao
Jing Zhang
Fangqing Mu
Zhengyi Wang
Shao-Jun Xia
Yufeng Jin
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Citations (2)
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