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Hua Gan
Hua Gan
Peking University
Materials science
System in package
Electronic engineering
Pirani gauge
Optoelectronics
5
Papers
10
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Investigation of a unified LTCC-based micromachining and packaging platform for high density/multifunctional microsystem integration
2012
ECTC | Electronic Components and Technology Conference
Min Miao
Yufeng Jin
Hua Gan
Jing Zhang
Yunsong Qiu
Yang Zhang
Yang-Fei Zhang
Rui Cao
Zhensong Li
Zhengyi Wang
Fangqing Mu
Chengchen Gao
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A novel LTCC capacitive accelerometer embedded in LTCC packaging substrate
2011
NEMS | Nano/Micro Engineered and Molecular Systems
Hua Gan
Yufeng Jin
Min Miao
Xin Sun
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A vacuum/airtight package with multifunctional LTCC substrate and integrated pirani vacuum gauge for 3D SIP integration applications
2010
ICSICT | IEEE International Conference on Solid-State and Integrated Circuit Technology
Min Miao
Hua Gan
Yufeng Jin
Zhensong Li
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A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge
2010
NEMS | Nano/Micro Engineered and Molecular Systems
Min Miao
Jing Zhang
Yunsong Qiu
Yang-Fei Zhang
Yufeng Jin
Hua Gan
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A micro in-situ Pirani vacuum gauge for microsystem package applications
2010
ICEPT | International Conference on Electronic Packaging Technology
Hua Gan
Yunsong Qiu
Min Miao
Yufeng Jin
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