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C. Greene
C. Greene
Binghamton University
Temperature cycling
Soldering
Acceleration
Vibration
Thermal
5
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51
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A mechanistic model of damage evolution in lead free solder joints under combinations of vibration and thermal cycling with varying amplitudes
2019
Microelectronics Reliability
Peter Borgesen
Luke Wentlent
Thaer Alghoul
R. Sivasubramony
Manu Yadav
Sanoop Thekkut
J. L. Then Cuevas
C. Greene
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Citations (7)
A mechanistic model for the life of solder joints under realistic long-term service conditions
2018
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Peter Borgesen
Luke Wentlent
Thaer Alghoul
S. Joshi
R. Sivasubramony
Manu Yadav
Sanoop Thekkut
J. L. Then Cuevas
L. E. Alvarez
C. Greene
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A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints
2018
Journal of Electronic Materials
Peter Borgesen
Luke Wentlent
Sa'd Hamasha
Saif Khasawneh
Sam Shirazi
Debora Schmitz
Thaer Alghoul
C. Greene
Liang Yin
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Citations (25)
Constitutive Relations for Finite Element Modeling of SnAgCu in Thermal Cycling -- How Wrong We Were!
2016
ECTC | Electronic Components and Technology Conference
Thaer Alghoul
Dustin Watson
Nardeeka Adams
Saif Khasawneh
Farhan Batieha
C. Greene
Peter Borgesen
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Citations (8)
Interpreting accelerated test results for lead free solder joints
2016
Peter Borgesen
Sa'd Hamasha
Luke Wentlent
D. Watson
C. Greene
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Citations (11)
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