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J. L. Then Cuevas
J. L. Then Cuevas
Binghamton University
Soldering
Reliability engineering
Electronic engineering
Acceleration
New product development
3
Papers
12
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A mechanistic model of damage evolution in lead free solder joints under combinations of vibration and thermal cycling with varying amplitudes
2019
Microelectronics Reliability
Peter Borgesen
Luke Wentlent
Thaer Alghoul
R. Sivasubramony
Manu Yadav
Sanoop Thekkut
J. L. Then Cuevas
C. Greene
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Citations (7)
A mechanistic model for the life of solder joints under realistic long-term service conditions
2018
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Peter Borgesen
Luke Wentlent
Thaer Alghoul
S. Joshi
R. Sivasubramony
Manu Yadav
Sanoop Thekkut
J. L. Then Cuevas
L. E. Alvarez
C. Greene
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Assessing the Reliability of High Temperature Solder Alternatives
2017
ECTC | Electronic Components and Technology Conference
Maan Z. Kokash
R. Sivasubramony
J. L. Then Cuevas
A. F. Zamudio
Peter Borgesen
A. A. Zinn
R. M. Stoltenberg
JiaJia Chang
Y.-L. Tseng
D. Blass
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Citations (5)
1