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A. A. Zinn
A. A. Zinn
Lockheed Martin Space Systems
Soldering
Porosity
Materials science
Cycling
Forensic engineering
2
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30
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Assessing the Reliability of High Temperature Solder Alternatives
2017
ECTC | Electronic Components and Technology Conference
Maan Z. Kokash
R. Sivasubramony
J. L. Then Cuevas
A. F. Zamudio
Peter Borgesen
A. A. Zinn
R. M. Stoltenberg
JiaJia Chang
Y.-L. Tseng
D. Blass
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Citations (5)
Nanocopper Based Solder-Free Electronic Assembly
2014
Journal of Electronic Materials
K. Schnabl
Luke Wentlent
K. Mootoo
Saif Khasawneh
A. A. Zinn
J. Beddow
E. Hauptfleisch
D. Blass
Peter Borgesen
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Citations (25)
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