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Lingyun Wei
Lingyun Wei
Dow Chemical Company
Metallurgy
Ductility
Copper plating
Calculus
Engineering
4
Papers
4
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Invited) Copper Plating and Its Application in Advanced Packaging
2016
Lingyun Wei
Matthew Thorseth
Mark Scalisi
Jonathan Prange
Inho Lee
Yil-Hak Lee
yoon Joo Kim
Mark Lefebvre
Jeffrey M. Calvert
Wataru Tachikawa
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Bain d'électrodéposition de cuivre acide et procédé de galvanisation à faible contrainte interne et une bonne ductilité des dépôts de cuivre
2016
Lingyun Wei
Rebecca Hazebrouck
Bryan Lieb
Yu-Hua Kao
Mark Lefebvre
Robert Corona
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Enabling Low-Temperature Bonding in Advanced Packaging Using Electrodeposited Indium
2016
ECTC | Electronic Components and Technology Conference
Yi Qin
Kristen Flajslik
Brandon Sherzer
Emily Banelis
Inho Lee
Regina Cho
Louis Grippo
Masaaki Imanari
Mark Lefebvre
Lingyun Wei
Wataru Tachikawa
Jianwei Dong
Jeffrey M. Calvert
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Low Stress and High Ductility Copper Electroplating Additive Development
2015
Lingyun Wei
Yu Hua Kao
Rebecca Hazebrouck
Robert Corona
Bryan Lieb
Ying Wang
Michael Lowe
Mark Lefebvre
Sung-Ho Pyo
Wataru Tachikawa
Jeffrey M. Calvert
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