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Yichao Xu
Yichao Xu
Peking University
Materials science
Electronic engineering
Composite material
Wafer
Nanoelectromechanical systems
6
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7
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Low-frequency testing of through silicon vias for defect diagnosis in three-dimensional integration circuit stacking technology
2014
ECTC | Electronic Components and Technology Conference
Yichao Xu
Min Miao
Runiu Fang
Xin Sun
Yunhui Zhu
Minggang Sun
Guanjiang Wang
Yufeng Jin
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Investigation of a TSV-RDL in-line fault-diagnosis system and test methodology for wafer-level commercial production
2014
ECTC | Electronic Components and Technology Conference
Runiu Fang
Min Miao
Xin Sun
Yunhui Zhu
Guanjiang Wang
Yichao Xu
Minggang Sun
Yufeng Jin
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Study of TSV leakage current and breakdown voltage
2013
ICEPT | International Conference on Electronic Packaging Technology
Yichao Xu
Guanjiang Wang
Xin Sun
Runiu Fang
Min Miao
Yufeng Jin
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Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration
2013
NEMS | Nano/Micro Engineered and Molecular Systems
Zhiyuan Zhu
Shaonan Wang
Yichao Xu
Guanjiang Wang
Yudan Pi
Peiquan Wang
Yunhui Zhu
Xin Sun
Min Yu
Jing Chen
Min Miao
Yufeng Jin
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In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging
2013
NEMS | Nano/Micro Engineered and Molecular Systems
Yichao Xu
Guanjiang Wang
Xin Sun
Runiu Fang
Min Miao
Yufeng Jin
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High speed test structures for in-line process of 3D system in packaging
2013
ICEPT | International Conference on Electronic Packaging Technology
Guanjiang Wang
Zhiyuan Zhu
Yichao Xu
Runiu Fang
Min Miao
Yufeng Jin
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Citations (2)
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