Old Web
English
Sign In
Acemap
>
authorDetail
>
Pranavi Chandupatla
Pranavi Chandupatla
Electronic engineering
Microprocessor
Computer science
Wafer bonding
Offset (computer science)
3
Papers
2
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (3)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
3D-Split SRAM: Enabling Generational Gains in Advanced CMOS
2021
CICC | Custom Integrated Circuits Conference
Rahul Mathur
Mudit Bhargava
H Perry
A. Cestero
F Frederick
S. Hung
C Chao
Daniel Smith
Daniel Fisher
Norman W. Robson
Xiaoqing Xu
Pranavi Chandupatla
R. Balachandran
Saurabh Sinha
Brian Cline
Jaydeep P. Kulkarni
Show All
Source
Cite
Save
Citations (0)
Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology.
2020
arXiv: Hardware Architecture
Rahul Mathur
Chien-Ju Chao
Rossana Liu
Nikhil Tadepalli
Pranavi Chandupatla
Shawn Hung
Xiaoqing Xu
Saurabh Sinha
Jaydeep P. Kulkarni
Show All
Source
Cite
Save
Citations (0)
Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology
2020
ECTC | Electronic Components and Technology Conference
Rahul Mathur
Chien-Ju Chao
Rossana Liu
Nikhil Tadepalli
Pranavi Chandupatla
Shawn Hung
Xiaoqing Xu
Saurabh Sinha
Jaydeep P. Kulkarni
Show All
Source
Cite
Save
Citations (2)
1