Old Web
English
Sign In
Acemap
>
authorDetail
>
Chien-Ju Chao
Chien-Ju Chao
Computer science
Microprocessor
Wafer bonding
Netlist
Transistor
3
Papers
2
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (3)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology.
2020
arXiv: Hardware Architecture
Rahul Mathur
Chien-Ju Chao
Rossana Liu
Nikhil Tadepalli
Pranavi Chandupatla
Shawn Hung
Xiaoqing Xu
Saurabh Sinha
Jaydeep P. Kulkarni
Show All
Source
Cite
Save
Citations (0)
Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology
2020
ECTC | Electronic Components and Technology Conference
Rahul Mathur
Chien-Ju Chao
Rossana Liu
Nikhil Tadepalli
Pranavi Chandupatla
Shawn Hung
Xiaoqing Xu
Saurabh Sinha
Jaydeep P. Kulkarni
Show All
Source
Cite
Save
Citations (2)
Cell with shifted boundary, and boundary shifting scheme
2013
Kuo-Nan Yang
Chou-Kun Lin
Jerry Chang-Jui Kao
Yi-Chuin Tsai
Chien-Ju Chao
Chung-Hsing Wang
Show All
Source
Cite
Save
Citations (0)
1