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S. Y. Chen
S. Y. Chen
TSMC
Silicon
Through-silicon via
Electronic engineering
Electrical engineering
Design for manufacturability
2
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29
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High-aspect ratio through silicon via (TSV) technology
2012
VLSIT | Symposium on VLSI Technology
H. B. Chang
H. Y. Chen
Po Chen Kuo
Chao-Hsin Chien
E.B. Liao
Tsung-Shu Lin
T. S. Wei
Yen-Liang Lin
Yen-Huei Chen
Kuo-Nan Yang
H.A. Teng
Wu-Chin Tsai
Yung-Chang Tseng
S. Y. Chen
Cheng-Hsiang Hsieh
M.F. Chen
Y. H. Liu
Tsang-Jiuh Wu
Shang-Yun Hou
Wen-Chih Chiou
S.P. Jeng
Chen-Hua Yu
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Electromigration study of micro bumps at Si/Si interface in 3DIC package for 28nm technology and beyond
2011
ECTC | Electronic Components and Technology Conference
Tsung-Shu Lin
R. D. Wang
M.F. Chen
Christine Chiu
S. Y. Chen
Tung-Chin Yeh
Larry C. Lin
Shang-Yun Hou
J. C. Lin
K.h. Chen
Shin-puu Jeng
Douglas Yu
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Citations (16)
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