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E.B. Liao
E.B. Liao
TSMC
Electronic engineering
Electrical engineering
CMOS
Through-silicon via
Engineering
4
Papers
99
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An integrated air gap structure to achieve high-performance TSV interconnects for 28nm 3D-IC integration
2013
VLSIT | Symposium on VLSI Technology
E.B. Liao
K. W. Cheng
Yen-Huei Chen
H.A. Teng
Y. C. Tseng
W. C. Tsai
J.H. Chen
Tsung-Shu Lin
Kuo-Nan Yang
Yen-Liang Lin
H. B. Chang
T. S. Wei
H. Y. Chen
M.F. Chen
Cheng-Hsiang Hsieh
Tsang-Jiuh Wu
C.H. Wu
D.Y. Shih
Wen-Chih Chiou
S.P. Jeng
Chen-Hua Yu
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Citations (2)
High-aspect ratio through silicon via (TSV) technology
2012
VLSIT | Symposium on VLSI Technology
H. B. Chang
H. Y. Chen
Po Chen Kuo
Chao-Hsin Chien
E.B. Liao
Tsung-Shu Lin
T. S. Wei
Yen-Liang Lin
Yen-Huei Chen
Kuo-Nan Yang
H.A. Teng
Wu-Chin Tsai
Yung-Chang Tseng
S. Y. Chen
Cheng-Hsiang Hsieh
M.F. Chen
Y. H. Liu
Tsang-Jiuh Wu
Shang-Yun Hou
Wen-Chih Chiou
S.P. Jeng
Chen-Hua Yu
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Citations (13)
TSV process optimization for reduced device impact on 28nm CMOS
2011
VLSIT | Symposium on VLSI Technology
Chien Yu
Chih-Sheng Chang
H.Y. Wang
J.H. Chang
L.H. Huang
C.W. Kuo
S.P. Tai
Shang-Yun Hou
W.L. Lin
E.B. Liao
Kuo-Nan Yang
Tsang-Jiuh Wu
Wen-Chih Chiou
Chih-Hang Tung
S.P. Jeng
Chen-Hua Yu
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Citations (21)
High density 3D integration using CMOS foundry technologies for 28 nm node and beyond
2010
IEDM | International Electron Devices Meeting
Jeng-Shyan Lin
W.C. Chiou
Kuo-Nan Yang
H. B. Chang
You-Ru Lin
E.B. Liao
Jui-Pin Hung
Y.L. Lin
Pang-Yen Tsai
Y.C. Shih
T.J. Wu
W.J. Wu
F.W. Tsai
Yu-Lien Huang
T.Y. Wang
Chien Yu
Chih-Sheng Chang
M.F. Chen
Shang-Yun Hou
Chih-Hang Tung
Shin-puu Jeng
Doug C. H. Yu
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Citations (63)
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