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F.W. Tsai
F.W. Tsai
TSMC
Through-silicon via
Electronic engineering
Electrical engineering
Redistribution layer
Three-dimensional integrated circuit
2
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70
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Yield and reliability of 3DIC technology for advanced 28nm node and beyond
2011
VLSIT | Symposium on VLSI Technology
Kuo-Nan Yang
Tsang-Jiuh Wu
Wen-Chih Chiou
M.F. Chen
Yen-Liang Lin
F.W. Tsai
Cheng-Hsiang Hsieh
Chih-Sheng Chang
Wei Cheng Wu
Yen-Huei Chen
T.Y. Chen
H.R. Wang
I.C. Lin
S. B. Jan
R. D. Wang
Y.J. Lu
Y.C. Shih
H.A. Teng
C.S. Tsai
M.N. Chang
Kim Hong Chen
Shang-Yun Hou
S.P. Jeng
Chen-Hua Yu
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High density 3D integration using CMOS foundry technologies for 28 nm node and beyond
2010
IEDM | International Electron Devices Meeting
Jeng-Shyan Lin
W.C. Chiou
Kuo-Nan Yang
H. B. Chang
You-Ru Lin
E.B. Liao
Jui-Pin Hung
Y.L. Lin
Pang-Yen Tsai
Y.C. Shih
T.J. Wu
W.J. Wu
F.W. Tsai
Yu-Lien Huang
T.Y. Wang
Chien Yu
Chih-Sheng Chang
M.F. Chen
Shang-Yun Hou
Chih-Hang Tung
Shin-puu Jeng
Doug C. H. Yu
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Citations (63)
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