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C.S. Tsai
C.S. Tsai
TSMC
Electronic engineering
Electrical engineering
Computer science
eDRAM
Capacitance
3
Papers
13
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A high density cylinder-type MIM capacitor integrated with advanced 28nm logic High-K/Metal-Gate process for embedded DRAM
2012
VLSI-TSA | International Symposium on VLSI Technology, Systems, and Applications
K.C. Tu
C.C. Wang
Y.T. Hsieh
Y.W. Ting
C.Y. Chang
C.Y. Pai
K.C. Tzeng
H.C. Chu
Horng-Chih Lin
Y.W. Chang
C.N. Pen
K.W. Chen
T.H. Hsieh
C.Y. Tsai
K. C. Huang
W.C. Chiang
M.J. Wang
Ching-Chun Wang
C.S. Tsai
Shou Gwo Wuu
H.Y. Hwang
Luan C. Tran
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Citations (2)
Yield and reliability of 3DIC technology for advanced 28nm node and beyond
2011
VLSIT | Symposium on VLSI Technology
Kuo-Nan Yang
Tsang-Jiuh Wu
Wen-Chih Chiou
M.F. Chen
Yen-Liang Lin
F.W. Tsai
Cheng-Hsiang Hsieh
Chih-Sheng Chang
Wei Cheng Wu
Yen-Huei Chen
T.Y. Chen
H.R. Wang
I.C. Lin
S. B. Jan
R. D. Wang
Y.J. Lu
Y.C. Shih
H.A. Teng
C.S. Tsai
M.N. Chang
Kim Hong Chen
Shang-Yun Hou
S.P. Jeng
Chen-Hua Yu
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A high-performance low-power highly manufacturable embedded DRAM technology using backend hi-k MIM capacitor at 40nm node and beyond
2011
VLSI-TSA | International Symposium on VLSI Technology, Systems, and Applications
C.Y. Chen
W.C. Chiang
C. Y. Shen
K.C. Tu
K.C. Tzeng
H.F. Lee
K. C. Huang
Y.S. Cheng
C.Y. Chang
H.C. Chu
Ching-Chun Wang
C.S. Tsai
Cormac Michael Oconnell
T.H. Hsieh
H.W. Chin
M.J. Wang
S. G. Wuu
Sreedhar Natarajan
Luan C. Tran
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Citations (4)
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