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Johannes Jaeschke
Johannes Jaeschke
Materials science
Mechanical engineering
Temperature cycling
Soldering
Finite element method
5
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4
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Sporadic Early Life Solder Ball Detachment Effects on Subsequent Microstructure Evolution and Fatigue of Solder Joints in Wafer-Level Chip-Scale Packages
2020
Journal of microelectronics and electronic packaging
Simon Schambeck
Matthias Hutter
Johannes Jaeschke
Andrea Deutinger
Martin Schneider-Ramelow
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FEM-based combined degradation model of wire bond and die-attach for lifetime estimation of power electronics
2020
Microelectronics Reliability
Arian Grams
Johannes Jaeschke
Olaf Wittler
Benjamin Fabian
Sven Thomas
Martin Schneider-Ramelow
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Warpage Investigation of PCB Embedding Technology – Determination of Relevant Modelling Parameters by Means of FEM and Experiments
2019
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Florian Rost
Saskia Huber
Hans Walter
Marius van Dijk
Thomas Cramer
Johannes Jaeschke
Olaf Wittler
Martin Schneider-Ramelow
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Combined Reliability Testing: An approach to assure reliability under complex loading conditions
2012
Olaf Wittler
Johannes Jaeschke
Olaf Bochow-Ness
Andreas Middendorf
Klaus-Dieter Lang
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Präventive Ansätze zur zuverlässigkeitsorientierten Produktentwicklung
2008
Daniel Steffen
Johannes Jaeschke
Andreas Middendorf
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