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Florian Rost
Florian Rost
Fraunhofer Society
Materials science
Die (manufacturing)
Composite material
Mechanical engineering
Stress (mechanics)
5
Papers
17
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Simulation challenges of warpage for wafer- and panel level packaging
2020
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Marius van Dijk
Simon Kuttler
Florian Rost
Johannes Jeaschke
Hans Walter
Olaf Wittler
Tanja Braun
Martin Schneider-Ramelow
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Warpage Investigation of PCB Embedding Technology – Determination of Relevant Modelling Parameters by Means of FEM and Experiments
2019
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Florian Rost
Saskia Huber
Hans Walter
Marius van Dijk
Thomas Cramer
Johannes Jaeschke
Olaf Wittler
Martin Schneider-Ramelow
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Technologies for the integration of miniaturised silicon sensor systems in fibre-reinforced composites
2019
Benjamin Arnold
Ricardo Decker
Florian Rost
Angelika Bauer
Jan Mehner
Lothar Kroll
S. Rzepka
Thomas Otto
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Mechanical in-situ characterization of micro systems during encapsulation and integration processes in structural components
2016
Electronics System-integration Technology Conference
Florian Rost
Benjamin Arnold
Dietmar Vogel
B. Michel
Sven Rzepka
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Measurements of the mechanical stress induced in flip chip dies by the underfill and simulation of the underlying phenomena of thermal-mechanical and chemical reactions
2014
ESTC | Electronics System-integration Technology Conference
Florian Schindler-Saefkow
Florian Rost
Angelika Schingale
Daniela Wolf
B. Wunderle
J. Keller
B. Michel
Sven Rzepka
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Citations (9)
1