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Simon Kuttler
Simon Kuttler
Fraunhofer Society
Microelectronics
Computer simulation
Electromagnetic compatibility
Temperature measurement
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2
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4
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Influence of Ball Size and Geometry on the Reliability and RF Performance of mmWave System-in-Package: A Simulation Approach
2021
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Seyyid Dilek
Ivan Ndip
Marco Rossi
Christian Tschoban
Simon Kuttler
Olaf Wittler
Klaus-Dieter Lang
Christian Goetze
Daniel Berger
Marcel Wieland
Martin Schneider-Ramelow
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Simulation challenges of warpage for wafer- and panel level packaging
2020
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Marius van Dijk
Simon Kuttler
Florian Rost
Johannes Jeaschke
Hans Walter
Olaf Wittler
Tanja Braun
Martin Schneider-Ramelow
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Citations (4)
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