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Tyson Alvanos
Tyson Alvanos
Materials science
Electronic engineering
Wafer
NMOS logic
High-κ dielectric
2
Papers
4
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A novel methodology for wafer-specific feed-forward management of backside silicon removal by wafer grinding for optimized through silicon via reveal
2014
ECTC | Electronic Components and Technology Conference
Tyson Alvanos
John J. Garant
Yu Iijima
Richard F. Indyk
Christopher Rosenthal
Osamu Sato
Naoki Sugase
Hideo Takizawa
Frank Wei
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Impact of wafer thinning on High-K Metal Gate 20nm devices
2013
ECTC | Electronic Components and Technology Conference
Adam Beece
Rahul Agarwal
Sandhya Chandrashekhar
Jagar Singh
Siddhartha Siddhartha
Ramakanth Alapati
Biju Parameshwaran
Jeff Dumas
Tyson Alvanos
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