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Soh Siew Boon
Soh Siew Boon
Agency for Science, Technology and Research
Materials science
Wafer-level packaging
Electronic engineering
Composite material
Optoelectronics
5
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10
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Double Mold Antenna in Package for 77 GHz Automotive Radar
2020
EPTC | Electronics Packaging Technology Conference
Soon Wee Ho
Soh Siew Boon
Lau Boon Long
Hsiao Hsiang Yao
Chong Ser Choong
Sharon Lim Pei Siang
Lim Teck Guan
Chai Tai Chong
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Fan-Out Packaging with Thin-film Inductors
2020
EPTC | Electronics Packaging Technology Conference
Soh Siew Boon
Ho Soon Wee
Simon Lim Siak Boon
Sharon Lim Pei Siang
Ravinder Pal Singh
Salahuddin Raju
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Magnetic Inductor Integration in FO-WLP using RDL-first Approach
2019
EPTC | Electronics Packaging Technology Conference
Soh Siew Boon
David Ho Soon Wee
Raju Salahuddin
Ravinder Pal Singh
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Fine pitch RDL patterning characterization
2016
EPTC | Electronics Packaging Technology Conference
Chen Bing
Soh Siew Boon
Ho Soon Wee
Jung Boo Yang
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Evaluation on multiple layer PBO-based Cu RDL process for Fan-Out Wafer Level Packaging (FOWLP)
2016
EPTC | Electronics Packaging Technology Conference
Soh Siew Boon
King Jien Chui
S. W. David Ho
Soon Ann Sek
Mingbin Yu
Prayudi Lianto
Yu Gu
Guan Huei See
Marvin L. Bernt
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Citations (3)
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