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Simon Lim Siak Boon

Agency for Science, Technology and Research

5

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7

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Power Module on Copper Lead Frame with Novel Sintering Paste and SnSb solder

2020 EPTC | Electronics Packaging Technology Conference
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Fan-Out Packaging with Thin-film Inductors

2020 EPTC | Electronics Packaging Technology Conference
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Demonstration of Vertically Integrated POP using FOWLP Approach

2020 ECTC | Electronic Components and Technology Conference
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Comprehensive Design and Analysis of Fan-Out Wafer Level Package

2019 EPTC | Electronics Packaging Technology Conference
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Development of Antenna on FO-WLP

2018 EPTC | Electronics Packaging Technology Conference
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