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Yoshihiro Uozumi
Yoshihiro Uozumi
Toshiba
Materials science
Copper
Copper interconnect
Metallurgy
Dielectric
3
Papers
15
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Self-Formed Barrier Technology using CuMn Alloy Seed for Copper Dual-Damascene Interconnect with porous-SiOC/porous-PAr Hybrid Dielectric
2007
IITC | International Interconnect Technology Conference
Takeshi Watanabe
Hayato Nasu
Gaku Minamihaba
N. Kurashima
Akifumi Gawase
Miyoko Shimada
Yasuhito Yoshimizu
Yoshihiro Uozumi
Hideki Shibata
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Citations (7)
Development of an Eco-friendly Copper Interconnect Cleaning Process
2007
IITC | International Interconnect Technology Conference
Yoshihiro Uozumi
Takahito Nakajima
Tsuyoshi Matsumura
Yasuhito Yoshimizu
Hiroshi Tomita
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Citations (1)
High Performance Ultra Low-k (k=2.0/keff=2.4)/Cu Dual-Damascene Interconnect Technology with Self-Formed MnSixOy Barrier Layer for 32 nm-node
2006
IITC | International Interconnect Technology Conference
Takamasa Usui
Kazumichi Tsumura
Hayato Nasu
Yumi Hayashi
Gaku Minamihaba
H. Toyoda
H. Sawada
S. Ito
Hideshi Miyajima
Kei Watanabe
Miyoko Shimada
Akihiro Kojima
Yoshihiro Uozumi
Hideki Shibata
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Citations (7)
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