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Amit Nangia
Amit Nangia
Texas Instruments
Materials science
Composite material
Metallurgy
Soldering
Wafer
5
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11
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A Methodology to Integrate Thermo-Mechanical Reliability Predictions into Co-design of Flip-Chip-On-Lead Devices
2018
ECTC | Electronic Components and Technology Conference
Siva P. Gurrum
Manu Prakuzhy
Guangxu Li
Hung-Yun Lin
Saumya Gandhi
J. Carlos Arroyo
Frank Mortan
Amit Nangia
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Correlated Model for Wafer Warpage Prediction of Arbitrarily Patterned Films
2018
ECTC | Electronic Components and Technology Conference
Gregory T. Ostrowicki
Siva P. Gurrum
Amit Nangia
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Reduction of Cu-Ni-Pd pad discoloration caused by Cu re-deposition
2016
EPTC | Electronics Packaging Technology Conference
Laura May Antoinette Clemente
Kejun Zeng
Amit Nangia
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Effect of high temperature bake on evolution of interfacial structure in Cu wire bonds and its impact on Cu/Al interfacial corrosion
2015
ECTC | Electronic Components and Technology Conference
Kejun Zeng
Amit Nangia
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Thermal cycling reliability of SnAgCu solder joints in WLCSP
2014
EPTC | Electronics Packaging Technology Conference
Kejun Zeng
Amit Nangia
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