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Guangxu Li
Guangxu Li
Texas Instruments
Electronic engineering
Materials science
Composite material
Finite element method
Soldering
3
Papers
2
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0
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A Methodology to Integrate Thermo-Mechanical Reliability Predictions into Co-design of Flip-Chip-On-Lead Devices
2018
ECTC | Electronic Components and Technology Conference
Siva P. Gurrum
Manu Prakuzhy
Guangxu Li
Hung-Yun Lin
Saumya Gandhi
J. Carlos Arroyo
Frank Mortan
Amit Nangia
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An Image-Based Effective Property Method for Strip Warpage Modeling
2016
ECTC | Electronic Components and Technology Conference
Siva P. Gurrum
Guangxu Li
Hung-Yun Lin
Yong Lin
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An improved peel stress-based correlation to predict solder joint reliability of lidded flip chip ball grid array packages
2015
ECTC | Electronic Components and Technology Conference
Guangxu Li
Siva P. Gurrum
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