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Bong Yin Yen
Bong Yin Yen
Metrology
Chip-scale package
Wafer-level packaging
Redistribution layer
Process control
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Automated Metrology Improves Productivity and Yields for Wafer Level Packaging in High Volume Manufacturing
2014
Jin You Zao
Bong Yin Yen
Lim Beng Kuan
John Thornell
Darcy Hart
David S. Marx
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