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Yongsik Yu
Yongsik Yu
Electromigration
Dielectric
Materials science
Smart material
Metallurgy
4
Papers
19
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In-situ Formation of a Copper Silicide Cap For TDDB and Electromigration Improvement
2006
IRPS | International Reliability Physics Symposium
Kaushik Chattopadhyay
Bart van Schravendijk
Tom Mountsier
Glenn B. Alers
M. Hornbeck
Hui-Jung Wu
Roey Shaviv
Greg Harm
D. Vitkavage
E. Apen
Yongsik Yu
R. Havemann
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Citations (11)
Highly Reliable Interface of Self-aligned CuSiN process with Low-k Sic barrier dielectric (k3.5) for 65nm node and beyond
2006
IITC | International Interconnect Technology Conference
Tatsuya Usami
T. Ide
Y. Kakuhara
Y. Ajima
Kazuyoshi Ueno
T. Maruyama
Yongsik Yu
E. Apen
Kaushik Chattopadhyay
B. van Schravendijk
Noriaki Oda
M. Sekine
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Citations (8)
Adaptive Materials with Polydomain Structures
1995
Yongsik Yu
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Adaptive Materials with Polydomain Structures
1995
Yongsik Yu
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