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Yosuke Sogo
Yosuke Sogo
Osaka University
Soldering
Composite material
Materials science
Reflow soldering
Metallurgy
5
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16
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Effects of Interfacial Microstructure on Strength of Solder Joint Using Sn-Ag-Bi-In Solder
2005
Akio Hirose
Takashi Hojo
Yosuke Sogo
Ryoko Miwa
Kojiro F. Kobayashi
Atsushi Yamaguchi
Akio Furusawa
Kazuto Nishida
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Soldering Properties and Interfacial Microstructure of CSP Solder Joints with Lower Melting Lead-free Solder
2005
Journal of microelectronics and electronic packaging
Atsushi Yamaguchi
Yuhei Yamashita
Akio Furusawa
Kazuto Nishida
Takashi Hojo
Yosuke Sogo
Ayako Miwa
Akio Hirose
Kojiro F. Kobayashi
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Soldering Properties and Interfacial Microstructure of BGA Solder Joints with Sn-Ag-Bi-In Solder
2005
Journal of Japan Institute of Electronics Packaging
Atsushi Yamaguchi
Yuhei Yamashita
Akio Furusawa
Kazuto Nishida
Takashi Hojo
Yosuke Sogo
Ayako Miwa
Akio Hirose
Kojiro F. Kobayashi
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Properties of Solder Joints Using Sn-Ag-Bi-In Solder
2004
Materials Transactions
Atsushi Yamaguchi
Yuhei Yamashita
Akio Furusawa
Kazuto Nishida
Takashi Hojo
Yosuke Sogo
Ayako Miwa
Akio Hirose
Kojiro F. Kobayashi
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Properties of CSP solder joints using Sn-8Zn-3Bi solder
2003
Takashi Hojo
hiroaki iwanishi
Yosuke Sogo
Akio Hirose
Kojiro F. Kobayashi
Atsushi Yamaguchi
Akio Furusawa
Kazuto Nishida
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