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Ryoko Miwa
Ryoko Miwa
Osaka University
Microstructure
Intermetallic
Ball grid array
Ranging
Reflow soldering
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Effects of Interfacial Microstructure on Strength of Solder Joint Using Sn-Ag-Bi-In Solder
2005
Akio Hirose
Takashi Hojo
Yosuke Sogo
Ryoko Miwa
Kojiro F. Kobayashi
Atsushi Yamaguchi
Akio Furusawa
Kazuto Nishida
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