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R. Miyazawa
R. Miyazawa
IBM
Semiconductor device
Materials science
Composite material
Through-silicon via
Soldering
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Solder Injected through Via for Multi Stacked Wafers
2016
ECTC | Electronic Components and Technology Conference
Akihiro Horibe
Kuniaki Sueoka
R. Miyazawa
Toyohiro Aoki
Sayuri Kohara
Keishi Okamoto
Hiroyuki Mori
Yasumitsu Orii
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