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N. Dayanand
N. Dayanand
Analysis Group
Electronic engineering
Materials science
Wafer fabrication
Root cause
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4
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2
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Failure Analysis Methodology on Systematic MIM failure in Wafer Fabrication
2018
IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
Angela Teo
Ang Ghim Boon
Ng Hui Peng
Chen Chang Qing
Xu Nai Yun
N. Dayanand
Tam Yong Seng
Mai Zhi Hong
Jeffrey Lam
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Uncovered the “hidden real defect” masked by “other anomaly seen” through deep dive FA in wafer fabrication
2017
IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
Angela Teo
Ng Hui Peng
Ang Ghim Boon
Chen Chang Qing
Xu Nai Yun
N. Dayanand
Tam Yong Seng
Mai Zhi Hong
Jeffrey Lam
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Static fault localization on Memory failures using Photon Emission Microscopy
2015
IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
N. Dayanand
A. C. T. Quah
C. Q. Chen
G. B. Ang
S. Moon
H. P. Ng Z. H. Mai
Jeffrey Lam
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Defect localization enhancement using light induced CI-AFP
2014
IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
N. Dayanand
A. C. T. Quah
C. Q. Chen
S.P. Neo
G. B. Ang
M. Gunawardana
Z. H. Mai
Jeffrey Lam
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