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G. Allen
G. Allen
Intel
Materials science
Lithography
Copper
Electronic engineering
Interconnection
3
Papers
30
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Demonstration of a 12 nm-half-pitch copper ultralow-k interconnect process
2013
IITC | International Interconnect Technology Conference
Jasmeet S. Chawla
Ramanan V. Chebiam
Rohan Akolkar
G. Allen
Colin T. Carver
James S. Clarke
Florian Gstrein
M. Harmes
Tejaswi K. Indukuri
Christopher J. Jezewski
Brian Krist
Hazel Lang
Alan Myers
Richard Schenker
Kanwal Jit Singh
Robert B. Turkot
Hui Jae Yoo
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Citations (14)
Demonstration of an electrically functional 34 nm metal pitch interconnect in ultralow-k ILD using spacer-based pitch quartering
2012
IITC | International Interconnect Technology Conference
M. van Veenhuizen
G. Allen
M. Harmes
Tejaswi K. Indukuri
Christopher J. Jezewski
Brian Krist
Hazel Lang
Alan Myers
Richard Schenker
Kanwal Jit Singh
Robert B. Turkot
Hui Jae Yoo
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Citations (16)
Simulation of dense contact hole (κ1=0.35) arrays with 193 nm immersion lithography
2006
Alex K. Raub
Abani M. Biswas
Y. Borodovsky
G. Allen
S. R. J. Brueck
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