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N. Robson
N. Robson
GlobalFoundries
Electronic engineering
Transistor
Optoelectronics
Data retention
Logic gate
4
Papers
17
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A high-density logic-on-logic 3DIC design using face-to-face hybrid wafer-bonding on 12nm FinFET process
2020
IEDM | International Electron Devices Meeting
Saurabh Sinha
S. Hung
Daniel Fisher
Xiaoqing Xu
C Chao
P. Chandupatla
F Frederick
H Perry
Daniel Smith
Alberto Cestero
John M. Safran
V. Ayyavu
M Bhargava
R. Mathur
D. Prasad
Robert Katz
A. Kinsbruner
John J. Garant
Jorge Lubguban
Sarah H. Knickerbocker
V. Soler
Brian Cline
R Christy
T McLaurin
N. Robson
Daniel G. Berger
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Citations (3)
Face to Face Hybrid Wafer Bonding for Fine Pitch Applications
2020
ECTC | Electronic Components and Technology Conference
Daniel Fisher
Sarah H. Knickerbocker
Daniel Smith
Robert Katz
John J. Garant
Jorge Lubguban
Vilmarie Soler
N. Robson
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Citations (6)
Turning Logic Transistors into Secure, Multi-Time Programmable, Embedded Non-Volatile Memory Elements for 14 nm FINFET Technologies and Beyond
2019
VLSIT | Symposium on VLSI Technology
Faraz Khan
Dan Moy
D. Anand
E.H. Schroeder
Robert Katz
L. Jiang
Edmund Banghart
N. Robson
Toshiaki Kirihata
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Citations (3)
Design Optimization and Modeling of Charge Trap Transistors (CTTs) in 14 nm FinFET Technologies
2019
IEEE Electron Device Letters
Faraz Khan
Min Soo Han
Dan Moy
Robert Katz
L. Jiang
Edmund Banghart
N. Robson
Toshiaki Kirihata
Jason C. S. Woo
Subramanian S. Iyer
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Citations (5)
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