Old Web
English
Sign In
Acemap
>
authorDetail
>
Sarah H. Knickerbocker
Sarah H. Knickerbocker
GlobalFoundries
Wafer bonding
Optoelectronics
fine pitch
Materials science
Logic gate
2
Papers
9
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (2)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
A high-density logic-on-logic 3DIC design using face-to-face hybrid wafer-bonding on 12nm FinFET process
2020
IEDM | International Electron Devices Meeting
Saurabh Sinha
S. Hung
Daniel Fisher
Xiaoqing Xu
C Chao
P. Chandupatla
F Frederick
H Perry
Daniel Smith
Alberto Cestero
John M. Safran
V. Ayyavu
M Bhargava
R. Mathur
D. Prasad
Robert Katz
A. Kinsbruner
John J. Garant
Jorge Lubguban
Sarah H. Knickerbocker
V. Soler
Brian Cline
R Christy
T McLaurin
N. Robson
Daniel G. Berger
Show All
Source
Cite
Save
Citations (3)
Face to Face Hybrid Wafer Bonding for Fine Pitch Applications
2020
ECTC | Electronic Components and Technology Conference
Daniel Fisher
Sarah H. Knickerbocker
Daniel Smith
Robert Katz
John J. Garant
Jorge Lubguban
Vilmarie Soler
N. Robson
Show All
Source
Cite
Save
Citations (6)
1