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Michal Danek
Michal Danek
Applied Materials
Physics
Chemical engineering
Oxide
Thin film
Tungsten
4
Papers
59
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Thermal stability of atomic layer deposited WCxNy electrodes for metal oxide semiconductor devices
2018
Journal of Applied Physics
Oren Zonensain
Sivan Fadida
Ilanit Fisher
Juwen Gao
Michal Danek
M. Eizenberg
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Citations (1)
Work function tuning of plasma-enhanced atomic layer deposited WCxNy electrodes for metal/oxide/semiconductor devices
2015
Applied Physics Letters
Oren Zonensain
Sivan Fadida
Ilanit Fisher
Juwen Gao
Kaushik Chattopadhyay
Greg Harm
Tom Mountsier
Michal Danek
M. Eizenberg
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Citations (9)
Fabrication d'un film sur une tranche semi-conductrice
1997
Chyl Chern
Michal Danek
Marvin Liao
Karl A. Littau
Roderick Craig Mosely
Ivo Raaijmakers
David C. Smith
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Resistivity reduction and chemical stabilization of organometallic chemical vapor deposited titanium nitride by nitrogen rf plasma
1996
Applied Physics Letters
Michal Danek
Marvin Liao
Jennifer Tseng
Karl A. Littau
D. Saigal
Hong Zhang
Roderick Craig Mosely
M. Eizenberg
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Citations (49)
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