Old Web
English
Sign In
Acemap
>
authorDetail
>
Tian Tan
Tian Tan
Central South University
Electrode
Chemical engineering
Electrolyte
Materials science
Through-silicon via
1
Papers
1
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (1)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Using a triblock copolymer as a single additive in high aspect ratio through silicon via (TSV) copper filling
2021
Microelectronic Engineering
Fuliang Wang
Yuhang Tian
Kang Zhou
Rui Yang
Tian Tan
Yan Wang
Wenhao Yao
Show All
Source
Cite
Save
Citations (1)
1