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H. P. Pu
H. P. Pu
TSMC
Materials science
Bandwidth (signal processing)
Eutectic system
Composite material
Soldering
4
Papers
15
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Applications and Reliability Study of InFO_UHD (Ultra-High-Density) Technology
2020
ECTC | Electronic Components and Technology Conference
T. Ko
H. P. Pu
Y. Chiang
H.J. Kuo
C. T. Wang
C. S. Liu
Douglas Yu
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Citations (3)
Signal Integrity of Submicron InFO Heterogeneous Integration for High Performance Computing Applications
2019
ECTC | Electronic Components and Technology Conference
Chuei-Tang Wang
Jeng-Shien Hsieh
Victor C. Y. Chang
Shih-Ya Huang
T. Ko
H. P. Pu
Douglas Yu
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Citations (9)
Fabrication and Characterization of Millimeter Wave 3D InFO Dipole Antenna Array Integrated with CMOS Front-end Circuits
2019
IEDM | International Electron Devices Meeting
C.H. Tsai
T.-L. Wu
C. S. Liu
C. T. Wang
Doug C. H. Yu
Che-Wei Hsu
K. Y. Kao
Tzu-Chun Tang
C. L. Lu
Kai-Chiang Wu
H. P. Pu
K.Y. Lin
Huei Wang
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Citations (3)
Reliability Assessment of Sn-Pb and Pb-free Solder Joints under the Cyclic Bend and Shear Tests
2007
ICEPT | International Conference on Electronic Packaging Technology
Yung-Sheng Chen
C. S. Wang
C. T. Fan
Kuo-Chin Chang
H. P. Pu
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