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Takamasa Okuma
Takamasa Okuma
Chip-scale package
Materials science
Composite material
Electronic engineering
Characteristic impedance
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Development of core-less substrate for multi wiring layers
2002
EPTC | Electronics Packaging Technology Conference
Masataka Maehara
Isao Kato
Satoshi Akimoto
Takamasa Okuma
R. Iino
T. Tsukamoto
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