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Clark Linde
Clark Linde
Intel
Electronic engineering
Materials science
Composite material
Through-silicon via
Wafer testing
2
Papers
126
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Integrated on-chip inductors using magnetic material (invited)
2008
Journal of Applied Physics
Donald S. Gardner
Gerhard Schrom
Peter Hazucha
Fabrice Paillet
Tanay Karnik
Shekhar Borkar
Roy Hallstein
Tony Dambrauskas
Charles Hill
Clark Linde
Wojciech Worwag
Robert Baresel
Sriram Muthukumar
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Citations (92)
Fabrication and electrical characterization of 3D vertical interconnects
2006
ECTC | Electronic Components and Technology Conference
Michael Newman
Sriram Muthukumar
Mark E. Schuelein
Tony Dambrauskas
Patrick Dunaway
John M. Jordan
Sudhakar N. Kulkarni
Clark Linde
Tony A. Opheim
Robert Allen Stingel
Wojciech Worwag
Lee Topic
Johanna M. Swan
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Citations (34)
1