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tubo matu yosiaki
tubo matu yosiaki
Electronic engineering
Materials science
Chip-scale package
Chip
Computer science
5
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無電解Ni/Pd/Auめっきにおけるはんだボール接続信頼性―無電解Pdめっき皮膜のリン濃度および膜厚の影響―
2017
eziri yosinori
sakurai takesi kyuu
arayama takasi sin
tubo matu yosiaki
hasegawa kiyosi
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Couche métallique composite comportant une feuille métallique de corps de support, carte de câblage utilisant la couche métallique composite, procédé pour fabriquer la carte de câblage, et procédé pour fabriquer un boîtier de semi-conducteurs à l'aide de la carte de câblage
2011
Kouichi Tanabe
Bianhaoyi Tian
Nobuchika Yagihashi
bamuqiaodunmu
Tadashi Tamura
tiancunkuangshi
Kuniji Suzuki
Lingmubang Si
Yoshiaki Tsubomatsu
tubo matu yosiaki
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Composite metal layer provided with supporting body metal foil, wiring board using the composite metal layer, method for manufacturing the wiring board, and method for manufacturing semiconductor package using the wiring board
2011
Bianhaoyi Tian
bamuqiaodunmu
tiancunkuangshi
Lingmubang Si
tubo matu yosiaki
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ポリイミドフィルムを用いたCSP(Chip Size/Scale Package)用基板
1998
inoue fumio
tubo matu yosiaki
yusa masami
hasegawa kiyosi
tobe toyoo
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Wire dispensing board for electric test and manufacture of same
1994
Fuzhishu Fu
nakamura hidehiro
nakayama hazime
tubo matu yosiaki
zhongcunzhengze
haidongguangyi
sangyedunsi
dubianyijinfu
banqiaoyayan
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