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Sun-jung Lee
Sun-jung Lee
Samsung
Metallurgy
Materials science
Annealing (metallurgy)
Dielectric
Electronic engineering
4
Papers
10
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0
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Integration and reliability of a noble TiZr/TiZrN alloy barrier for Cu/low-k interconnects
2005
IITC | International Interconnect Technology Conference
Bong-seok Suh
Seung-Man Choi
Young Jin Wee
Jung-eun Lee
Jun-Ho Lee
Sun-jung Lee
Soo-Geun Lee
Hong-jae Shin
Nae-in Lee
Ho-Kyu Kang
Kwang Pyuk Suh
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New insight into stress induced voiding mechanism in Cu interconnects
2005
IITC | International Interconnect Technology Conference
Sun-jung Lee
Soo-Geun Lee
Bong-Suk Suh
Hong-jae Shin
Nae-in Lee
Ho Kyu Kang
Gwangpyuk Suh
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Advanced i-PVD barrier metal deposition technology for 90 nm Cu interconnects
2003
IITC | International Interconnect Technology Conference
Kyu-Charn Park
I. R. Kim
Bong-seok Suh
Seungwook Choi
Won-sang Song
Young Jin Wee
Sun-jung Lee
J.S. Chung
J. H. Chung
S.R. Hah
Jeong-Hoon Ahn
Ki-Jong Lee
H. K. Kang
K.P. Suh
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Process integration of CVD Cu as a seed layer for Cu electroplating and a plug-fill application
2000
IITC | International Interconnect Technology Conference
Ki-Chul Park
Seungman Choi
Sun-jung Lee
Kyu-hwan Chang
Hyeon-deok Lee
Ho Kyu Kang
Sang In Lee
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