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Fang Jie Foo
Fang Jie Foo
Advanced Micro Devices
Materials science
Electronic engineering
Electronic circuit
Thermal management of electronic devices and systems
Die (integrated circuit)
3
Papers
2
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0
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Failure Analysis for Qualification of Stiffener Attachment to Thin-core Substrates
2019
EPTC | Electronics Packaging Technology Conference
Wai Kit Tang
Syahirah M. Zulkifli
Fang Jie Foo
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Recent advances in fault isolation for semiconductor industry
2013
IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
J.M. Chin
Vinod Narang
M.Y. Tay
Shei Lay Phoa
Ravikumar Venkat
Lwin Hnin Ei
Soon Huat Lim
Chea-Wei Teo
Syahirah Zulkifli
Wen Qiu
Joseph Tan
Gopi Ranganathan
Zi Ying Oh
Fang Jie Foo
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Fundamental study of fracture strength of silicon dies in flip-chip lidless packages
2012
EPTC | Electronics Packaging Technology Conference
Ravi Subramaniyan Sathanantham
Fang Jie Foo
Zi Ying Oh
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