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Rémi Beneyton
Rémi Beneyton
Materials science
Composite material
Nanotechnology
Void (astronomy)
Direct bonding
5
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47
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Ultra-Thin (4nm) Gate-All-Around CMOS devices with High-k/Metal for Low Power Multimedia Applications
2009
J.-L. Huguenin
Stephane Monfray
G. Bidal
Stephane Denorme
Pierre Perreau
Nicolas Loubet
Yves Campidelli
M.-P. Samson
Christian Arvet
K. Benotmane
Francois Leverd
Pascal Gouraud
B. Le-Gratiet
C. De-Butet
L. Pinzelli
Rémi Beneyton
S. Barnola
T. Morel
Aomar Halimaoui
Frederic Boeuf
Gérard Ghibaudo
Thomas Skotnicki
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substrates assembly process with heat treatment was low temperatures
2006
Rémi Beneyton
Hubert Moriceau
Frank Fournel
F. Rieutord
Tiec Yannick Le
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Rough Surface Adhesion Mechanisms for Wafer Bonding.
2006
F. Rieutord
H. Moriceau
Rémi Beneyton
Luciana Capello
Christophe Morales
Anne-Marie Charvet
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Effect of Prebonding Surface Treatments on Si-Si Direct Bonding : Bonding Void Decrease
2006
Rémi Beneyton
Frank Fournel
F. Rieutord
Christophe Morales
H. Moriceau
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Low Temperature Void Free Hydrophilic or Hydrophobic Silicon Direct Bonding
2006
Frank Fournel
H. Moriceau
Rémi Beneyton
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