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R.K. Trichur
R.K. Trichur
Dielectric
Polymer
Through-silicon via
Copper
Temperature cycling
1
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Filling and Planarizing Deep Trenches with Polymeric Material for Through-Silicon Via Technology
2010
R.K. Trichur
M. Fowler
J. W. McCutcheon
M. Daily
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Citations (4)
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