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R.K. Huang
R.K. Huang
State University of New York System
Thermophotovoltaic
Isotropic etching
Photoluminescence
Wafer bonding
Epitaxy
3
Papers
24
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Wafer bonding and epitaxial transfer of GaSb-based epitaxy to GaAs for monolithic interconnection of thermophotovoltaic devices
2004
Journal of Electronic Materials
Christine A. Wang
D.A. Shiau
P.G. Murphy
P.W. O'brien
R.K. Huang
Michael K. Connors
A.C. Anderson
D. Donetsky
S. Anikeev
G. Belenky
D.M. DePoy
G. Nichols
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Citations (9)
Wafer bonding and epitaxial transfer of GaSb-based epitaxy to GaAs for monolithic interconnection of thermophotovoltaic devices
2004
Journal of Electronic Materials
C.A. Wang
D.A. Shiau
P.G. Murphy
P.W. O'brien
R.K. Huang
Michael K. Connors
Alfredo C. Anderson
D. Donetsky
S. Anikeev
Gregory Belenky
D. M. DePoy
G. Nichols
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Citations (14)
Wafer bonding and epitaxial transfer of GaSb-based epitaxy to GaAs for monolithic interconnection of thermophotovoltaic devices
2003
C.A. Wang
D.A. Shiau
P.G. Murphy
P.W. O'brien
R.K. Huang
Michael K. Connors
A.C. Anderson
D. Donetsky
S. Anikeev
G. Belenky
D.M. DePoy
G. Nichols
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Source
Cite
Save
Citations (1)
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