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De-Huei Liu
De-Huei Liu
Inorganic chemistry
Materials science
Copper plating
Metallurgy
1
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Through-Hole Filling by Copper Electroplating Using a Single Organic Additive
2011
Electrochemical and Solid State Letters
Wei-Ping Dow
De-Huei Liu
Chun-Wei Lu
Chien-Hung Chen
Jhih-Jyun Yan
Su-Mei Huang
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Citations (41)
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