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Michael Thiele
Michael Thiele
GlobalFoundries
Chip
Flip chip
Electronic engineering
Pillar
Stack (abstract data type)
4
Papers
10
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Package Qualification Envelope for 22FDX® Technology
2019
Christian Klewer
Frank Kuechenmeister
Jens Paul
Dirk Breuer
Bjoern Boehme
Jae Kyu Cho
Simone Capecchi
Michael Thiele
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Chip package interaction with Cu Pillar interconnects - systematic study of key factors impacting the qualification
2017
Bjoern Boehme
Dirk Breuer
Christian Goetze
Al Rhea Estoque
Falk Tischer
Frank Kuechenmeister
Jens Paul
Michael Thiele
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A Generic Strategy to Assess and Mitigate Chip Package Interaction Risk Factors for Semiconductor Devices with Ultra-low k Dielectric Materials in Back End of Line
2017
Frank Kuechenmeister
Dirk Breuer
Holm Geisler
Christian Klewer
Bjoern Boehme
Kashi Vishwanath Machani
Michael Hecker
Christian Goetze
Jae Kyu Cho
Himani Kamineni
Jens Paul
Michael Thiele
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Citations (6)
Advanced chip package interaction qualification for critical stacks in combination with Cu pillar interconnect technology
2016
Electronics System-integration Technology Conference
Bjoern Boehme
Christian Goetze
Sebastian Dej
Po-Hsiang Wang
Frank Kuechenmeister
Dirk Breuer
Jens Paul
Michael Thiele
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Citations (2)
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