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Masaki Shimada
Masaki Shimada
Toshiba
Materials science
Metallurgy
Copper interconnect
Porous medium
Porosity
3
Papers
3
Citations
0
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A Study of Adhesion and Improvement of Adhesion Energy Using Hybrid Low-k (porous-PAr/ porous-SiOC(k=2.3/2.3)) Structures with Multi-layered Cu Interconnects for 45-nm Node Devices
2007
IITC | International Interconnect Technology Conference
Tatsuya Usami
Chikaze Maruyama
M. Tagami
Ken Watanabe
Takatoshi Kameshima
Hiroji Masuda
Masaki Shimada
A. Gawase
Yutaka Kagawa
Nozomi Nakamura
Hideki Miyajima
H. Naruse
Yasushi Enomoto
Tomotaka Kitano
Michiaki Sekine
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Citations (2)
A Study of Water Absorption Induced-Dielectric Constant Increase and Its Suppression on Copper Damascene Interconnect Structure with Porous Low-k (k=2.3) Dielectrics
2006
IITC | International Interconnect Technology Conference
N. Nakamura
Noriaki Matsunaga
Kazuyuki Higashi
Masaki Shimada
Hideshi Miyajima
Masaki Yamada
Y. Enomoto
Toshiaki Hasegawa
Hideki Shibata
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Citations (1)
Producing a corrosion and wear-resistant alloy
1989
Kyoichi Sasaki
Masaki Shimada
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