Preparation method of high-thermal conductivity diamond/aluminum composite material

The invention belongs to the field of electronic packaging materials and relates to a preparation method of a high-thermal conductivity diamond/aluminum composite material. The preparation method comprises the following steps: preparing diamond particles into preform; putting the diamond preform to a mould, putting Al-Si alloy, the size of which is 1.3-1.8 times of that of the diamond preform, to the preform, wherein the mass content of the Si is 15%; putting the mixture to a heating furnace for keeping the temperature of 900 DEG C to 950 DEG C for 30-60 minutes under the protection of pure nitrogen gas to obtain the high-thermal conductivity diamond/aluminum composite material. The diamond/aluminum composite material prepared by a pressure impregnation technology has excellent thermal conductivity and can satisfy the requirements of a large-power electronic packaging material.