Investigation on Immersion Defectivity Root Cause
2007
The introduction of immersion lithography in the production phase has been accompanied with high level of defects
compared to standard process on dry lithography. Continuous process optimization allowed us to reduce the defectivity
to dry lithography level. This learning cycle also permitted to improve our knowledge on immersion defectivity
formation. Immersion lithography process cause specific defects type as watermarks, bubbles, extra pattern and swelling
of lines.
We will report in this article on our latest experiment on the understanding of defects formation during immersion
process. The influence of the track and scanner parameters has been investigated as well as materials issue (resist, topcoat).
Measurements of leaching, receding contact angle and water uptake have been performed in order to correlate
with defect formation. It appears that material, track and scanner parameters play different role on the formation of
specific immersion defects.
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