Polysilicon Failure Stress and Young’s Modulus Evaluation in MEMS Devices

The main object of the paper is the implementation of two different approaches for the estimation of the modulus of elasticity and of the failure strain/stress in micro machined structures manufactured of epitaxial polycrystalline silicon (15 μm thick film). The micro-test-structures are produced using a standard THELMA process becoming an integral part of a MEMS actuator of comb-finger type. The micro-motor is designed to develop electrostatic in plane forces of desired intensity when fed by suitable electric potential difference.© 2003 ASME