Formation of highly planarized Ni–W electrodeposits for glass imprinting mold

We confirmed that increasing the total metal concentration is effective for the planarization of Ni–W films and Ni–W nanopatterns formed with a uniform height and a 480 nm pitch. At the same time, the W content in Ni–W films decreased. We investigated the relationship between the planarization of Ni–W films and the W content in Ni–W films, and confirmed that increasing the total metal concentration is effective for the inhibition of hydrogen generation. We pointed to the inhibition of hydrogen gas generation as a cause of the planarization of Ni–W films, and the reduction in the hydrogen generation amount necessary for the deposition of W as a cause of the reduction in the W content in Ni–W films. In order to obtain a flat plating film with a high W content, it is necessary to generate an adequate amount of hydrogen on the surface of the cathode and to remove hydrogen gas from the cathode surface immediately.