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Low-pressure sintering of silver micro- and nanoparticles for a high temperature stable pick & place die attach
Low-pressure sintering of silver micro- and nanoparticles for a high temperature stable pick & place die attach
2011
Kahler
Heuck
Stranz
Waag
Peiner
Keywords:
Flip chip
Materials science
Electronic packaging
Nanoparticle
Die (integrated circuit)
annealing
Nanotechnology
Sintering
Correction
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